Mixed Signal ASIC Solutions

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With an average of over 30 years experience in the semiconductor industry, the QLS team is a trusted advisor to companies designing SOCs and ASICs. Though all technical support is provided directly from our Partners, QLS will continue to support your project through to successful completion.

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Mixed Signal ASIC Solutions

Quantum Leap Solutions partner EnSilica offers Mixed Signal ASICs

EnSilica, a UK company founded in 2001, is a fabless ASIC supplier that designs and supplies digital & mixed signal ASICs for automotive/industrial, healthcare and communications markets.

With a staff of 156 >10% PhDs, Ensilica has expertise in System, RF, Analog, Mixed-Signal, Digital, Software Design, Verification, Test, Package development, Production & Supply Chain.

Committed to quality, EnSilica is ISO9001:2015 certified, is an ARM Approved Design and Function Safety Partner, a TSMC DCA and GF Partner, and an approved supplier to 3 major automotive Tier 1s and one industrial OEM.

EnSilica has offices in Oxford (HQ), Wokingham (UK), Sheffield (UK), Bangalore (India) and Porto Algere (Brazil).

EnSilica have ASIC and design expertise in the following application areas:

  • RF & Wireless:
    • RFIC design in CMOS, SiGe and BiCMOS
    • Low power GHz and sub-GHz radio design
    • Sub-1V operation
    • RFIC IP
    • Design of RF FE for LTE/5G, BT Classic/LE, WiFi, 802.15.6, NFC, DAB/FM, DVBS2X/RCS2
    • RF IP SoC integration
    • Custom radio designs
    • Safety & security critical proprietary radio
    • Optical communications
    • Rx/Tx
    • VCSEL/laser/LED drivers
    • Photodiode/APD receivers
  • Sensing & Control:
    • Sensor Integration
    • Multiple sensor integration
    • Motion, magnetic, gases, respiration, thermal, humidity bio functions etc.
    • High voltage / automotive
    • High/low-side (36V) current-sense amplifier, 5 uVrms 0-10 kHz noise, >90dB CMRR
    • Trimmed for gain and offset stability over PVT
    • Designed for redundancy and compliance with functional safety goals
    • Low-power / low-noise
    • Voltage amplifiers for bio-signals, noise 100 nV/√Hz 0-100Hz, >90dB CMRR, 5 uA supply current
    • Transimpedance amplifier for gyro sensor, 100 fA/√Hz noise, precise phase response
    • Transimpedance amplifier for bio-signals, 10 pA/ √Hz noise, 100 uA supply current
    • Complex impedance measurement front-end
  • Power Management:
    • Low-power SoC design
    • Multiple power modes
    • Energy scavenged
    • Low-power oscillators, PLLs
    • Power management
    • DC-DC, LDO
    • Voltage / Frequency scaling
    • With sub-1V operation, power gating
    • Custom logic and IO cell design including thick oxide libraries
  • Healthcare and Medical:
    • Low power sensor interface for wearable healthcare and medical :
    • 3 lead ECG support
    • 2 pulsed photocurrent measurement inputs and drivers for
    • PPG (Heart Rate)
    • SpO2
    • NIRS (near infra-red spectroscopy)
    • Fluorescent glucose sensing (non[1]invasive to body tissue)
    • Body temperature sensor
    • Differential capacitive sensor
    • MEMS sensor interfacing
    • Complete with reference board and software
  • Satellite RFICs
    • Ka band suitable for GEO, LEO
    • 17.2 to 21.2 GHz Rx
    • 27.5 to 30.0 GHz Tx
    • 4 Rx element paths
    • 4 Tx element paths
    • Ka-band fine gain and phase control
    • Integrated IQ frequency conversion
    • Comprehensive and flexible IQ IF/BB path to data converters
    • Low power operation VDDRF=1.1V
    • Logic at 1.8V
    • Support for large arrays
    • Analog, hybrid & digital beamforming
    • Small size WLCSP
  • Digital and DSP
    • Systems/DSP expertise include
    • Modem design – BLE/DVB/DAB/WiFi
    • Remote Radio Heads - DDC/DUC
    • Advanced MIMO processing and beamforming
    • Advanced Radar signal processing
    • Cryptography
    • Development of efficient data-path designs
    • Integration of high speed interfaces
    • PCIe, USB, MIPI, CSI-2, CPRI, 1/25/10Gb Ethernet, LPDDR/DDR
    • Processor integration
    • Cores - Arm, Cadence Tensilica, MIPS
    • AMBA - AHB/AXI/APB
    • Advanced Verification
    • Constrained random SV based verification using UVM and VIPs
    • Embedding system models in environment using MATLAB/SystemC
    • FPGA based prototyping / emulation
    • Bit accurate models and GPU acceleration in CUDA
    • Post silicon validation
    • Embedded software
    • DSP and embedded software development for Arm, TenSilica, GPUs
    • Linux drivers and BSP
    • Physical design
    • Experience with all main foundries TSMC, GF, and SMIC
    • All main nodes from 180nm to 6nm
    • DFT for mixed signal, RF and digital including memory and other BIST, Test Compression, Boundary scan, JTAG
    • Best in the class tools follow including Cadence, Synopsys, Mentor and Keysight
    • Low-power design: clock gating, switchable power domains, voltage and frequency scaling, near threshold

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