Manufacturing Services

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The QLS Sales Team

With an average of over 30 years experience in the semiconductor industry, the QLS team is a trusted advisor to companies designing SOCs and ASICs. Though all technical support is provided directly from our Partners, QLS will continue to support your project through to successful completion.

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Manufacturing Services

Quantum Leap Solutions offers Manufacturing Services. Outsource your ASIC or SOC manufacturing through QLS.  We can provide the foundry interface to TSMC and GlobalFoundries and manage your supply chain and inventory.  Let us manage your supply chain in a cost effective offering.

  • Wafer supply
  • Package design and qualification
  • Package assembly
  • Test Engineering
  • Quality
  • Yield analysis and improvement
  • Logistics

    • Quantum Leap Solutions offers Packaging Services by Promex and QP Technologies

    For close to 50 years, Promex has led the industry as a top-tier contract manufacturer specializing in intricate microelectronics component assembly. Our capabilities include:

  • Multiple SMT Lines
  • Chip-On-Board Expertise
  • Advanced Post-wafer Assembly Techniques: Wafer Dicing, Wafer Backgrinding, Die Attach, Flip Chip, Wire Bonding, and Encapsulation

    • Founded in 1992, QP Technologies (formerly Quik-Pak), a division of Promex Industries, is a leading provider of stateside microelectronic packaging, assembly, wafer preparation, and related services for a range of markets and applications. At our state-of-the-art facility in Escondido, Calif., we work closely with our customers to develop the solutions they need to get their new products to market quickly and in high volumes.


    Quantum Leap Solutions offers Manufacturing Services by Ensilica

    EnSilica operates as a fabless semiconductor company, outsourcing all manufacturing to selected partners while managing these partners with a dedicated in-house team of experts. This team includes specialists in wafer manufacturing, packaging, test engineering, quality, and logistics, led by a veteran with over 30 years of industry experience. EnSilica's supply chain management encompasses activities from wafer foundry to customer shipment, ensuring reliability, process data monitoring, continuous improvement, and safe launch during ramp-up. Their strategy focuses on technical excellence, customer satisfaction, and cost-effectiveness, leveraging successful partnerships with foundry, assembly, test, and qualification partners.

    Manufacturing Services Offerings

    Ensilica Manufacturing Services

    EnSilica's key manufacturing partners include foundry, assembly, test, and qualification partners. These partners are selected based on their best-in-class capabilities, previous experience, locality, capacity, and capability. EnSilica ensures that these partners meet international certifications and established systems such as ISO9001, ISO14001, TS16949, and ISO17025. The approval process involves audits, visits, questionnaires, and regular review meetings to monitor supplier performance and reliability

  • Supply Chain Overview: EnSilica's supply chain management focuses on mass production, industrialization, automotive quality assurance, and design phase support. Key activities include reliability monitoring, process data assessment, PCN/PTN handling, continuous improvement programs, safe launch during ramp-up, and qualification planning. The slide also highlights control plans, customer quality management, and failure analysis support.

  • Supplier and Customer Quality Management: Supplier quality management ensures products meet high standards by communicating requirements, monitoring performance indicators, addressing quality issues, and managing change notifications. Customer quality management focuses on adherence to customer specifications, process improvements, and a robust RMA process. EnSilica uses both suppliers and certified independent failure analysis laboratories to meet industry norms.

  • RMA Process and Reporting: The RMA process involves completing requests, tracking batch history, retesting returns, proposing resolutions, and ongoing investigations. Reporting includes metrics such as time to issue RMA numbers, confirmation of batch history, shipment delays, acknowledgment of parts, and corrective actions. The flowchart details steps from initial report to final actions.

  • Traceability and Yield Analysis Tools: Traceability involves programming ASICs with unique serial numbers stored in OTP, Fuses, or Flash. Product labeling includes part numbers, reel quantity, lot code, supplier code, manufacturing date, and delivery address details. Yield analysis tools compare methods like Part Average Testing and Good Unit Post Test, using histograms and circular matrix charts to highlight outliers and trends.


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    Package Types

  • OCCP - Open-cavity plastic packages are the ideal platform for new IC prototypes, as they are mechanically and electrically identical to your future transfer molded production parts.
  • Air-cavity QFN open-molded plastic packages (OmPP™) - Our open-molded plastic packages come in a variety of sizes and are ideal for prototype, mid volume or production volume applications.
  • Ceramic - We procure packages from industry-leading ceramic suppliers and assemble your devices to your specifications.
  • BGA Substrates - We work with you to develop and assemble your custom BGA, interposer or other laminate substrate.
  • Custom Configurations - We use a variety of techniques to adapt and modify existing packages, including laser micromachining.
  • Plastic over-molded QFN over-tooled - We offer a large selection of plastic over-molded QFN packages to provide quickturn engineering builds and other volume requirements.

    • Process Steps

  • Die Attach - Fully automated die attach and die placement services for prototype and volume assembly.
  • Wire Bonding - Au and Cu ball wire bonding, Al wedge bonding, and ribbon bonding.
  • Encapsulation Options - Fully closed, partially closed, or open (frames and lids or fully open cavity).
  • Marketing/Branding - Ensures proper identification of your completed devices.

    • Advanced Assembly Services

  • Chip on Board / Chip on Flex - Passive components can be mounted and die protected with encapsulation, frame and lid or custom covers.
  • Multichip Module (MCM) / System in Package (SiP) - Our flexible assembly processes can accommodate bonding of multiple components, including die and discretes, on a single substrate.
  • Chiplets - Chiplet assembly helps makes heterogeneous technology and cost-effective customization possible.
  • Flip-Chip Bonding - Placement of pre-bumped devices within 1-μm accuracy.
  • Stacked Die - Complete bonding, assembly and backgrinding capabilities.
  • Surface-Mount Technology (SMT) - Flexible processes accommodate single substrate bonding of multiple components, including passive SMT components.

    • Wafer Preparation

    • Backgrinding and Dicing - Complete wafer preparation services for wafers up to 300mm in diameter.
      • Expertise in die-attach film (DAF).
      • Backgrinding of full and partial wafers, bumped wafers and even individual die.
      • 300mm wafers thinned to 75μm.
      • 200mm and smaller wafers thinned to 25μm.
      • Precision dicing performed on virtually any substrate type, including SiC and GaN.
    • Die Sort / Pick and Place
      • Specific die selected for OCPP assembly.
      • Sorted into customer media of choice using electronic wafer map.
    • Individual Die Thinning - Individual die thinned down to 15μm.

    Laser Micromachining

    • 355nm q-switched solid-state ND:YAG
      • 20μ beam diameter
      • +/-20μ accuracy, 1μ resolution
      • Accommodates stock sheets up to 21” X 25”
      • CAD input via .dxf or Gerber files
    • Cut, drill, mark, or skive
    • Wide range of materials: stainless steel, FR4, polyimide, glass, silicon, sapphire, and many others
    • Pin 1 identification for wafers or packages
    • In-house fixture fabrication tool (stencils, jigs, templates, etc.)

    Design & Engineering

  • Our range of design and engineering services assist fabless semiconductor companies in releasing new products to market.
  • We support your requirements from scalable assembly processes to quick-turn assembly of proof-of-concept prototypes.
  • We design and fabricate substrates to your specifications, then complete the assembly process with your die for a turnkey solution.
  • We can also design custom frames to protect your open-cavity devices, provide artwork support for marking, and assist with generation of bonding diagrams.



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