Packaging Services

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Packaging Services

The QLS Sales Team

With an average of over 30 years experience in the semiconductor industry, the QLS team is a trusted advisor to companies designing SOCs and ASICs. Though all technical support is provided directly from our Partners, QLS will continue to support your project through to successful completion.

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Packaging Services

Quantum Leap Solutions offers Design Services by Promex and QP Technologies

For close to 50 years, Promex has led the industry as a top-tier contract manufacturer specializing in intricate microelectronics component assembly. Our capabilities include:

Multiple SMT Lines

Chip-On-Board Expertise

Advanced Post-wafer Assembly Techniques: Wafer Dicing, Wafer Backgrinding, Die Attach, Flip Chip, Wire Bonding, and Encapsulation

From early-stage prototypes to high-volume production, Promex excels at every phase. Our Silicon Valley-based Class 100 / Class 1000 cleanrooms are ISO 13485:2016 and ISO 9001:2015 certified and IPC technicians ensure precision and quality. We’re also ITAR registered and CA FDB licensed, assuring compliance.

Founded in 1992, QP Technologies (formerly Quik-Pak), a division of Promex Industries, is a leading provider of stateside microelectronic packaging, assembly, wafer preparation, and related services for a range of markets and applications. At our state-of-the-art facility in Escondido, Calif., we work closely with our customers to develop the solutions they need to get their new products to market quickly and in high volumes.

Promex and QP Technology Services

Package Types

OCCP - Open-cavity plastic packages are the ideal platform for new IC prototypes, as they are mechanically and electrically identical to your future transfer molded production parts.

Air-cavity QFN open-molded plastic packages (OmPP™) - Our open-molded plastic packages come in a variety of sizes and are ideal for prototype, mid volume or production volume applications.

Ceramic - We procure packages from industry-leading ceramic suppliers and assemble your devices to your specifications.

BGA Substrates - We work with you to develop and assemble your custom BGA, interposer or other laminate substrate.

Custom Configurations - We use a variety of techniques to adapt and modify existing packages, including laser micromachining.

Plastic over-molded QFN over-tooled - We offer a large selection of plastic over-molded QFN packages to provide quickturn engineering builds and other volume requirements.

Process Steps

Die Attach - Fully automated die attach and die placement services for prototype and volume assembly.

Wire Bonding - Au and Cu ball wire bonding, Al wedge bonding, and ribbon bonding.

Encapsulation Options - Fully closed, partially closed, or open (frames and lids or fully open cavity).

Marketing/Branding - Ensures proper identification of your completed devices.

Advanced Assembly Services

Chip on Board / Chip on Flex - Passive components can be mounted and die protected with encapsulation, frame and lid or custom covers.

Multichip Module (MCM) / System in Package (SiP) - Our flexible assembly processes can accommodate bonding of multiple components, including die and discretes, on a single substrate.

Chiplets - Chiplet assembly helps makes heterogeneous technology and cost-effective customization possible.

Flip-Chip Bonding - Placement of pre-bumped devices within 1-μm accuracy.

Stacked Die - Complete bonding, assembly and backgrinding capabilities.

Surface-Mount Technology (SMT) - Flexible processes accommodate single substrate bonding of multiple components, including passive SMT components.

Wafer Preparation

Backgrinding and Dicing - Complete wafer preparation services for wafers up to 300mm in diameter.
- Expertise in die-attach film (DAF).
- Backgrinding of full and partial wafers, bumped wafers and even individual die.
- 300mm wafers thinned to 75μm.
- 200mm and smaller wafers thinned to 25μm.
- Precision dicing performed on virtually any substrate type, including SiC and GaN.

Die Sort / Pick and Place
- Specific die selected for OCPP assembly.
- Sorted into customer media of choice using electronic wafer map.

Individual Die Thinning - Individual die thinned down to 15μm.

Laser Micromachining

355nm q-switched solid-state ND:YAG
- 20μ beam diameter
- +/-20μ accuracy, 1μ resolution
- Accommodates stock sheets up to 21” X 25”
- CAD input via .dxf or Gerber files
Cut, drill, mark, or skive
Wide range of materials: stainless steel, FR4, polyimide, glass, silicon, sapphire, and many others
Pin 1 identification for wafers or packages
In-house fixture fabrication tool (stencils, jigs, templates, etc.)

Design & Engineering

Our range of design and engineering services assist fabless semiconductor companies in releasing new products to market.

We support your requirements from scalable assembly processes to quick-turn assembly of proof-of-concept prototypes.

We design and fabricate substrates to your specifications, then complete the assembly process with your die for a turnkey solution.

We can also design custom frames to protect your open-cavity devices, provide artwork support for marking, and assist with generation of bonding diagrams.

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Applications


Medical & Biotech	Data & Telecom	Photonics	MEMS & Sensors
Promex is trusted by medical device companies within the surgical robot, implantable, and neuromodulation industries.	Complex subassemblies and components are critical for enabling rapid data transfer and clear voice communication.	Microelectronics are integral to the photonics industry, supporting the development of optical devices and technologies.	MEMS and sensors require the use of small-scale microelectronic components as the key to their development.


Military & Defense	Semiconductors	Automotive LiDAR
Promex serves the defense industry’s many innovate projects focused on microelectronics.	Miniature components form the basis of semiconductor devices and how they operate.	Microelectronics are a crucial component in the automotive and LiDAR industry.