Our Partners

Andes Technology

The leading embedded RISC-V CPU IP supplier in the world. Founding member of the RISC-V Foundation. Offering single and multicore 32 bit and 64 bit RISC-V solutions with custom instructions and Vector and DSP extensions.

The innovative configurable platform solution allows Andes' customers to construct unique system architecture and hardware/software partitioning to gain best optimization in all aspects.

Over 15,000 seats of Andes development suite.

Utilize Andes Custom Extension (ACE) software to add custom instructions, accelerators and coprocessor instructions.

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Alphacore

The Alphacore design team has extensive experience in delivering complete solutions for a diverse customer base, offering custom products and services that exceed performance requirements to fulfill applications needs.We can provide RF or mixed signal intellectual property (IP), specialized imaging systems, hardware-based cybersecurity solutions as well as custom design services.
Our engineers develop innovative analog and mixed-signal components that fit niche applications and their demanding needs perfectly.

Our focus areas are:

• Analog, Mixed Signal and RF Solutions
• Imaging Solutions
• Radiation Hardened Electronics
• Emerging Technologies

• Delta-Sigma
  • Consumer, IOT, Wearables
  • High Resolution, ultra low power
  • Lowest power up to a few MS/s

• Pipelined
  • Consumer, WiFi, Lidar
  • High Resolution, High Dynamic Range, Moderate power

• Hybrid SAR
  • Sat Comms, 5G, Automotive, Lidar, Exotic Compute
  • Highest Sample Rate, lowest power

• Parallel Flash
  • Sat Comms, 5G, Automotive
  • Low Resolution, Ultra-High Speed
  • Lowest power in the industry

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CoMIRA Solutions

CoMira's high-performance IP provides a superior level of programmability and configurability and features an extremely small die area that translates into significant cost savings for our clients. Each specific solution is customized for an end application by tailoring the IP based on the weight each of these factors carries towards achieving our client’s individual requirements.

CoMIRA's team offers unrivaled expertise in developing networking, storage and wireless system-on-chips (SOCs). CoMIRA produces high-quality results and offers a quicker turnaround time than larger engineering service firms that may have less experienced staff. CoMIRA's aim is to be both efficient and economical in order to offer an industry-leading return on investment.

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eTopus

eTopus is an innovator and technology leader of high performance, mixed-signal, ultra-high speed semiconductor inter-connect solutions.

eTopus pioneered the ADC-based DSP system architecture for ultra-high speed wireline applications. The innovative architecture, which delivers superior Bit Error Rate performance for 1-112G PAM-4 SerDes IP, has been proven over multiple generations of silicon and has been adopted by Tier-1 networking, storage, and 5G OEMs. Founded in 2014, eTopus has a world-class innovation team with a track record of inventing multiple industry firsts involving mixed signal circuits with complex DSP algorithms over nearly 25 years. eTopus currently holds 10 US patents from system algorithm to circuit implementation related to the ADC/DSP-based SerDes.

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Flex Logix

Flex Logix™ leader of embedded FPGA and AI Inferencing IP.

Flex Logix provides eFPGA cores which have density and performance similar to leading FPGAs in the same process node but only use standard cells. Our EFLX eFPGA is silicon proven in 180nm, 40nm, 28/22nm, 16nm and 12nm with 6/7nm EFLX eFPGA is in design and 5nm next.

Our eFPGA is based on a “tile” called EFLX 4K, which comes in two versions: all logic or mostly logic with some MACs (multiply-accumulators). The programmable logic is called LUTs (lookup tables) that can implement any Boolean function. EFLX 4K Logix has 4000 LUT4 equivalents, EFLX 4K DSP has 3000 LUT4s and 40 Multiplier-Accumulators (MACs): the MAC has a 22-bit pre-adder, a 22×22 multiple and a 48-bit post adder/accumulator. MACs can be combined or cascaded to form fast DSP functions. We can build an eFPGA array of tiles of any combination to match the requirement of the SoC (for 40nm-180nm we offer an EFLX 1K tile for smaller arrays).

• Scalable architecture support up to 250,000 LUTs and is available on TSMC 7/12/16/22/28/40nm, GlobalFoundries 12/14nm
• AI Inferencing IP can support 2 to 100 TOPS for more complex models

Mixel

Mixel is a leading provider of mixed-signal mobile IPs. We offer a wide portfolio of high-performance mixed-signal connectivity solutions. Mixel’s mixed-signal portfolio includes PHYs and SerDes, such as MIPI® PHYs (MIPI D-PHYSM, MIPI C-PHYSM, and MIPI M-PHY®,), LVDS, and Multi-standard SerDes cores.

Mixel’s Silicon-proven IP cores are readily available for integration into your products and are highly configurable for a wide range of applications. This allows you to develop your new systems rapidly, while dramatically reducing your risk, your time-to-market, and slashing your development and manufacturing cost.

Our designs are robust and modular to facilitate IP core porting and customization. This enables us to meet your unique and demanding requirements in the shortest possible time with minimal risk.

We have designed, characterized, and transferred to production our semiconductor IP cores at several leading foundries like TSMC, UMC, GlobalFoundries, SMIC, and TowerJazz, in many process technology nodes.

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Sarcina Tech

Packaging and substrate design partner

• Founded in 2011 in Palo Alto, CA
• Providing uncompromised semiconductory Turnkey Services:
  • Package substrate Design & Fabrication, Assembly & Test, Qulification, Production
• Experts in Advanced Package design (MCM, RF, Automotive, uProcessor)
• Turnkey manufacturing from fabricated wafers to chips
  • Wafers-in to Chips-out
  • Prototype and Production services
• Locations: Silicon Valley, USA; Taipei, Taiwan
• Technologies
  • Package Design
  • Model Extraction
  • Simulation
  • Channel Simulation
  • Design for Manufacturing
  • SiP and MCM
  • 56 Gb/s PAM-4
  • Wafer Probe Card
  • Final Test Hardware
  • Test Program Developmet

EnSilica

EnSilica, a UK company founded in 2001, is a fabless ASIC supplier that designs and supplies digital & mixed signal ASICs for automotive/industrial, healthcare and communications markets.

With a staff of 156 >10% PhDs, Ensilica has expertise in System, RF, Analog, Mixed-Signal, Digital, Software Design, Verification, Test, Package development, Production & Supply Chain.

Committed to quality, EnSilica is ISO9001:2015 certified, is an ARM Approved Design and Function Safety Partner, a TSMC DCA and GF Partner, and an approved supplier to 3 major automotive Tier 1s and one industrial OEM.

EnSilica has offices in Oxford (HQ), Wokingham (UK), Sheffield (UK), Bangalore (India) and Porto Algere (Brazil).

EnSilica have ASIC and design expertise in the following application areas:

• RF & Wireless:
  • RFIC design in CMOS, SiGe and BiCMOS
  • Low power GHz and sub-GHz radio design
  • Sub-1V operation
  • RFIC IP
  • Design of RF FE for LTE/5G, BT Classic/LE, WiFi, 802.15.6, NFC, DAB/FM, DVBS2X/RCS2
  • RF IP SoC integration
  • Custom radio designs
  • Safety & security critical proprietary radio
  • Optical communications
  • Rx/Tx
  • VCSEL/laser/LED drivers
  • Photodiode/APD receivers

• Sensing & Control:
  • Sensor Integration
  • Multiple sensor integration
  • Motion, magnetic, gases, respiration, thermal, humidity bio functions etc.
  • High voltage / automotive
  • High/low-side (36V) current-sense amplifier, 5 uVrms 0-10 kHz noise, >90dB CMRR
  • Trimmed for gain and offset stability over PVT
  • Designed for redundancy and compliance with functional safety goals
  • Low-power / low-noise
  • Voltage amplifiers for bio-signals, noise 100 nV/√Hz 0-100Hz, >90dB CMRR, 5 uA supply current
  • Transimpedance amplifier for gyro sensor, 100 fA/√Hz noise, precise phase response
  • Transimpedance amplifier for bio-signals, 10 pA/ √Hz noise, 100 uA supply current
  • Complex impedance measurement front-end

• Power Management:
  • Low-power SoC design
  • Multiple power modes
  • Energy scavenged
  • Low-power oscillators, PLLs
  • Power management
  • DC-DC, LDO
  • Voltage / Frequency scaling
  • With sub-1V operation, power gating
  • Custom logic and IO cell design including thick oxide libraries

• Healthcare and Medical:
  • Low power sensor interface for wearable healthcare and medical :
  • 3 lead ECG support
  • 2 pulsed photocurrent measurement inputs and drivers for
  • PPG (Heart Rate)
  • SpO2
  • NIRS (near infra-red spectroscopy)
  • Fluorescent glucose sensing (non[1]invasive to body tissue)
  • Body temperature sensor
  • Differential capacitive sensor
  • MEMS sensor interfacing
  • Complete with reference board and software

• Satellite RFICs
  • Ka band suitable for GEO, LEO
  • 17.2 to 21.2 GHz Rx
  • 27.5 to 30.0 GHz Tx
  • 4 Rx element paths
  • 4 Tx element paths
  • Ka-band fine gain and phase control
  • Integrated IQ frequency conversion
  • Comprehensive and flexible IQ IF/BB path to data converters
  • Low power operation VDDRF=1.1V
  • Logic at 1.8V
  • Support for large arrays
  • Analog, hybrid & digital beamforming
  • Small size WLCSP

• Digital and DSP
  • Systems/DSP expertise include
  • Modem design – BLE/DVB/DAB/WiFi
  • Remote Radio Heads - DDC/DUC
  • Advanced MIMO processing and beamforming
  • Advanced Radar signal processing
  • Cryptography
  • Development of efficient data-path designs
  • Integration of high speed interfaces
  • PCIe, USB, MIPI, CSI-2, CPRI, 1/25/10Gb Ethernet, LPDDR/DDR
  • Processor integration
  • Cores - Arm, Cadence Tensilica, MIPS
  • AMBA - AHB/AXI/APB
  • Advanced Verification
  • Constrained random SV based verification using UVM and VIPs
  • Embedding system models in environment using MATLAB/SystemC
  • FPGA based prototyping / emulation
  • Bit accurate models and GPU acceleration in CUDA
  • Post silicon validation
  • Embedded software
  • DSP and embedded software development for Arm, TenSilica, GPUs
  • Linux drivers and BSP
  • Physical design
  • Experience with all main foundries TSMC, GF, and SMIC
  • All main nodes from 180nm to 6nm
  • DFT for mixed signal, RF and digital including memory and other BIST, Test Compression, Boundary scan, JTAG
  • Best in the class tools follow including Cadence, Synopsys, Mentor and Keysight
  • Low-power design: clock gating, switchable power domains, voltage and frequency scaling, near threshold

Signature IP

Signature IP Corporation is a Silicon Valley startup, launched in 2021 after 3 years of incubation, with a focus on providing network-on-chip (NoC) IP and related SoC solutions. With rapidly growing SOC innovations in areas such as AI, 5G, and autonomous vehicles, as well as new technology such as chiplets and SIP, the dynamics of designing silicon to make it scalable, configurable and adaptable is fast changing.

New designs need enhanced flexibility in their NOC IP, supporting requirements like multi-core, complex IO interactions and advanced coherency while overcoming challenges in bandwidth / latency and reducing risks of expensive silicon rework. Signature IP's vision is to enable this innovation, be adaptable, and deliver reliable SOC IP to address the ever-changing needs of the semiconductor industry

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Silicon Creations

Silicon Creations provides world-class silicon intellectual property (IP) for precision and general-purpose timing (PLLs), oscillators, low-power, high-performance SerDes and high-speed differential I/Os for diverse applications including smart phones, wearables, consumer devices, processors, network devices, automotive, IoT, and medical devices. Silicon Creations' IP is proven and/or in high-volume mass production in process technologies up to the most advanced available in the industry.

With a complete commitment to customer satisfaction, Silicon Creations’ IP has an excellent record of taking first silicon to mass production.

Silicon Creations Product Guide