Our Partners

Alphacore

The Alphacore design team has extensive experience in delivering complete solutions for a diverse customer base, offering custom products and services that exceed performance requirements to fulfill applications needs. We can provide high performance data converter IP silicon proven on TSMC, GlobalFoundries and Trusted Foundries.  5GS/s, 10GS/s and 20GS/s ADC and DAC architectures.  Customizable to your end applications.  Suitable for sensing, automotive LiDar and Radar, satellite communications, defense and aerospace applications.  Radiation hardened options available as well.
Our engineers develop innovative analog and mixed-signal components that fit niche applications and their demanding needs perfectly.

Our focus areas are:

• Analog, Mixed Signal and RF Solutions
• Imaging Solutions
• Radiation Hardened Electronics
• Emerging Technologies

Data Converter Architectures

• Delta-Sigma
  • Consumer, IOT, Wearables
  • High Resolution, ultra low power
  • Lowest power up to a few MS/s

• Pipelined
  • Consumer, WiFi, Lidar
  • High Resolution, High Dynamic Range, Moderate power

• Hybrid SAR
  • Sat Comms, 5G, Automotive, Lidar, Exotic Compute
  • Highest Sample Rate, lowest power

• Parallel Flash
  • Sat Comms, 5G, Automotive
  • Low Resolution, Ultra-High Speed
  • Lowest power in the industry

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EnSilica

EnSilica, a UK company founded in 2001, is a fabless ASIC supplier that designs and supplies digital & mixed signal ASICs for automotive/industrial, healthcare and communications markets.

With a staff of 156 >10% PhDs, Ensilica has expertise in System, RF, Analog, Mixed-Signal, Digital, Software Design, Verification, Test, Package development, Production & Supply Chain.

Committed to quality, EnSilica is ISO9001:2015 certified, is an ARM Approved Design and Function Safety Partner, and an Arm Center of Excellence. Ensilica is a TSMC DCA and GF Partner, and an approved supplier to 3 major automotive Tier 1s and one industrial OEM. EnSilica is is also a VCA-lite partner.

EnSilica has offices in Oxford (HQ), Wokingham (UK), Sheffield (UK), Bangalore (India) and Porto Algere (Brazil).

EnSilica have ASIC and design expertise in the following application areas:

• RF & Wireless:
  • RFIC design in CMOS, SiGe and BiCMOS
  • Low power GHz and sub-GHz radio design
  • Sub-1V operation
  • RFIC IP
  • Design of RF FE for LTE/5G, BT Classic/LE, WiFi, 802.15.6, NFC, DAB/FM, DVBS2X/RCS2
  • RF IP SoC integration
  • Custom radio designs
  • Safety & security critical proprietary radio
  • Optical communications
  • Rx/Tx
  • VCSEL/laser/LED drivers
  • Photodiode/APD receivers

• Sensing & Control:
  • Sensor Integration
  • Multiple sensor integration
  • Motion, magnetic, gases, respiration, thermal, humidity bio functions etc.
  • High voltage / automotive
  • High/low-side (36V) current-sense amplifier, 5 uVrms 0-10 kHz noise, >90dB CMRR
  • Trimmed for gain and offset stability over PVT
  • Designed for redundancy and compliance with functional safety goals
  • Low-power / low-noise
  • Voltage amplifiers for bio-signals, noise 100 nV/√Hz 0-100Hz, >90dB CMRR, 5 uA supply current
  • Transimpedance amplifier for gyro sensor, 100 fA/√Hz noise, precise phase response
  • Transimpedance amplifier for bio-signals, 10 pA/ √Hz noise, 100 uA supply current
  • Complex impedance measurement front-end

• Power Management:
  • Low-power SoC design
  • Multiple power modes
  • Energy scavenged
  • Low-power oscillators, PLLs
  • Power management
  • DC-DC, LDO
  • Voltage / Frequency scaling
  • With sub-1V operation, power gating
  • Custom logic and IO cell design including thick oxide libraries

• Healthcare and Medical:
  • Low power sensor interface for wearable healthcare and medical :
  • 3 lead ECG support
  • 2 pulsed photocurrent measurement inputs and drivers for
  • PPG (Heart Rate)
  • SpO2
  • NIRS (near infra-red spectroscopy)
  • Fluorescent glucose sensing (non[1]invasive to body tissue)
  • Body temperature sensor
  • Differential capacitive sensor
  • MEMS sensor interfacing
  • Complete with reference board and software

• Satellite RFICs
  • Ka band suitable for GEO, LEO
  • 17.2 to 21.2 GHz Rx
  • 27.5 to 30.0 GHz Tx
  • 4 Rx element paths
  • 4 Tx element paths
  • Ka-band fine gain and phase control
  • Integrated IQ frequency conversion
  • Comprehensive and flexible IQ IF/BB path to data converters
  • Low power operation VDDRF=1.1V
  • Logic at 1.8V
  • Support for large arrays
  • Analog, hybrid & digital beamforming
  • Small size WLCSP

• Digital and DSP
  • Systems/DSP expertise include
  • Modem design – BLE/DVB/DAB/WiFi
  • Remote Radio Heads - DDC/DUC
  • Advanced MIMO processing and beamforming
  • Advanced Radar signal processing
  • Cryptography
  • Development of efficient data-path designs
  • Integration of high speed interfaces
  • PCIe, USB, MIPI, CSI-2, CPRI, 1/25/10Gb Ethernet, LPDDR/DDR
  • Processor integration
  • Cores - Arm, Cadence Tensilica, MIPS
  • AMBA - AHB/AXI/APB
  • Advanced Verification
  • Constrained random SV based verification using UVM and VIPs
  • Embedding system models in environment using MATLAB/SystemC
  • FPGA based prototyping / emulation
  • Bit accurate models and GPU acceleration in CUDA
  • Post silicon validation
  • Embedded software
  • DSP and embedded software development for Arm, TenSilica, GPUs
  • Linux drivers and BSP
  • Physical design
  • Experience with all main foundries TSMC, GF, and SMIC
  • All main nodes from 180nm to 6nm
  • DFT for mixed signal, RF and digital including memory and other BIST, Test Compression, Boundary scan, JTAG
  • Best in the class tools follow including Cadence, Synopsys, Mentor and Keysight
  • Low-power design: clock gating, switchable power domains, voltage and frequency scaling, near threshold

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Promex & QP Technologies

For close to 50 years, Promex has led the industry as a top-tier contract manufacturer specializing in intricate microelectronics component assembly. Our capabilities include:

Multiple SMT Lines

Chip-On-Board Expertise

Advanced Post-wafer Assembly Techniques: Wafer Dicing, Wafer Backgrinding, Die Attach, Flip Chip, Wire Bonding, and Encapsulation

From early-stage prototypes to high-volume production, Promex excels at every phase. Our Silicon Valley-based Class 100 / Class 1000 cleanrooms are ISO 13485:2016 and ISO 9001:2015 certified and IPC technicians ensure precision and quality. We’re also ITAR registered and CA FDB licensed, assuring compliance.

Your IC Packaging and Assembly Experts.
Founded in 1992, QP Technologies (formerly Quik-Pak), a division of Promex Industries, is a leading provider of stateside microelectronic packaging, assembly, wafer preparation, and related services for a range of markets and applications. At our state-of-the-art facility in Escondido, Calif., we work closely with our customers to develop the solutions they need to get their new products to market quickly and in high volumes.

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QuickLogic

Our Mission: To be a trusted partner for the Critical Infrastructure Sector by delivering purpose-built eFPGA IP, specialized FPGA devices and user tools that address critical security, reliability and operational demands in the most extreme environments, while ensuring long-term supply assurance.

Extreme Environments: QuickLogic tailors eFPGA IP and FPGA Devices for the Aerospace and Defense Industry, ensuring solutions are optimized for SWaP-C (Size, Weight, Power, and Cost), as well as extreme operating environments.

Security: In collaboration with Xiphera, QuickLogic eFPGA IP and FPGA Devices are Post Quantum Crytpographic (PQC) core-ready.

Chiplets: Leading with the industry's first UCIe-compatible FPGA Chiplet ecosystem—modular blocks for bespoke solutions.

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