Alphacore Joins Forces with Quantum Leap Solutions to Bring World-Class Design IP to the North American Commercial Market
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A Few Words About
Quantum Leap Solutions
Mission
To help Companies successfully complete their SOC and ASIC designs utilizing our silicon proven ecosystem of IP, Services and Semiconductor Manufacturing solutions
"Simplify your Life, Work with QLS"
Quantum Leap Solutions is a technical sales representative firm with offices in San Jose, Los Angeles, Austin and Boston.
We represent roughly 10 semiconductor intellectual property (IP) and design / manufacturing services companies with best in class, silicon proven, low risk solutions in select markets. We help systems and semiconductor companies with their IP and services selections. Our partners provide strong technical support to ensure first time right successful implementation of your design. We offer solutions from 3nm FinFET up to 130nm CMOS with experience in FDSOI and RFSOI.
Here is a high level summary of our solutions:
- Semiconductor IP: RISC-V processors, High Performance Data Converters, Low Jitter PLLs, SerDes (16G, 32G, 56G, 112G), Ethernet Interfaces (10GE, 25GE, 100GE) + 100G, 400G, 800G controllers, Network on Chip (NOC), Embedded FPGA (eFPGA), MIPI (C-PHY, D-PHY), and more
- Design Services: RTL design, Design Verification (DV), Physical Design (PD), Circuit Design, Arm and RISC-V designs centers with automotive expertise
- Package / Substrate design: Expertise in advanced package and substrate design including MCM, 2.5D, HFCBGA, HFCBGL, SiP for Commercial, Automotive, Biomedical and Space applications
- Mixed Signal ASIC designs: Mixed signal ASICs for Automotive Lidar and Radar, 5G, Broadband wireless (MIMO), Satellite Comms, Industrial IoT, Wearables with expertise in RF design and beam-forming. Automotive Functional Safety (Fusa) compliant and volume production of automotive ASIC designs.
Silicon IP
Quantum Leap Solutions offers an extensive portfolio of silicon proven digital and analog IP across many process platforms. IP is available Off the Shelf or can be ported or customized to your application requirements.
View Silicon IP
RISC-V
Quantum Leap Solutions offers IP and design tools to support your RISC-V development QLS partners, Andes Technologies is an industry leader in RISC-V IP, and provides platforms and tools to enable the most comprehensive embedded software development, as well as debug and test solutions.
View RISC-V Solutions
Design Services
Quantum Leap Solutions has partnered with ACL Design to provide engineering design service and expertise in the semiconductor, 5G, Edge Cloud, as well as other tech spaces.
View Our Design Services
QLS Markets & Applications
Optimizing Capacity, Connectivity and Security of the Cloud
QLS partners with companies that develop products that move and protect the world’s most valuable resource: data. Data enables businesses to better understand and serve their customers. Faster access to data enables real-time action to insights. Protecting this data is mission critical in our interconnected world. Our partners makes data centers and networks better by accelerating and safeguarding the movement and delivery of data by providing high-speed interfaces, security cores and chips that optimize the capacity, connectivity and security of the cloud.
- Servers, Storage PCIe gen4/5/6
- RISC-V 64 bit processors + DSP and Vector extensions (Linux or embedded)
- DDR
- eFPGA accelerators
- 112G SerDes with 100GE, 400GE, 800GE configurations
- PLL N3, N4, N5, N6/7, 12FFC, 16FFC
- Chiplets - 400GE, 800GE, PCIe Gen5/6
- Advanced Package/Substrate Design (Photonic IC, MCM, 2.5D Interposer, HFCBGA)
Silicon Proven IP Cores and ASIC Partners for your 5G, Wireless, RF and Satellite Projects
5G wireless technology is meant to deliver higher multi-Gbps peak data speeds, ultra low latency, more reliability, massive network capacity, increased availability, and a more uniform user experience to more users. Higher performance and improved efficiency empower new user experiences and connects new industries.
With high speeds, superior reliability and negligible latency, 5G will expand the mobile ecosystem into new realms. 5G will impact every industry, making safer transportation, remote healthcare, precision agriculture, digitized logistics — and more — a reality.
- Broadband Wireless, IoT, LeoSat, WiFi, RF
- RISC-V 32 bit / 64 bit processors + DSP and Vector extensions (Linux or embedded)
- ADC/DAC up to 20GB/s sampling (customizable)
- eFPGA accelerator and soft protocol / encryption
- SerDes multiprotocol (CPRI, JESD, 25GE, 100GE)
- PCIe gen 3/4/5
- PLL N3, N4, N5, N6/7, 12FFC, 16FFC
- RF and Wireless ASICs
- Advanced Package/Substrate Design
QLS is a Trusted Technical Sales Representative firm with Silicon IP, ASIC and Manufacturing Services and can advise you on best Silicon Solutions for your project
Tech analyst company IDC predicts that in total there will be 41.6 billion connected IoT devices by 2025, or "things." It also suggests industrial and automotive equipment represent the largest opportunity of connected "things,", but it also sees strong adoption of smart home and wearable devices in the near term.
- RISC-V 32 bit processors
- ADC/DACs - ultra low power (configurable)
- Multiprotocol SerDes - low power
- PLL – Low power
- Advanced Consumer Packaging solutions
- Turnkey Mixed Signal ASICs
Understanding Inferencing
From our partner Flex Logix: Modern Artifical Intelligence (AI) systems use a paradigm called machine learning. Machine learning (ML) is typically composed of both training and inferencing components. Training is the highly computationally intensive process where the machine (computer) learns how to perform a task. ML Training and is usually performed in very large scale cloud computing systems and can take a very long time to process (weeks or months) even when running on very high performance hardware. The output of the training process, a trained ML model, can be leveraged across many systems in the form of inference processing. Inference processing or inferencing is the term that is used to refer to the process of providing a response to a stimulus based on training from example data sets. Example inferencing tasks include object or face detection in images or video, understanding human speech, or identifying cancerous cells in X-Ray images.
- RISC-V 32 bit / 64 bit processors + DSP and Vector extensions (Linux or embedded)
- eFPGA accelerators
- DDR
- ADC/DAC up to 20GB/s sampling
- PCIe gen 4/5
- SerDes multiprotocol (CPRI, JESD, 25GE, 100GE)
- PLL N3, N4, N5, N6/7, 12FFC, 16FFC
- Advanced Package / Substrate Design
Automotive
The mobility of the future is “eascy” – electrified, autonomous, shared, connected and “yearly” updated.
Electrified – the transition to emissions-free mobility will become a global requirement. Electricity used to charge vehicles will increasingly come from renewable sources to ensure carbon dioxide-neutral mobility.
Autonomous - The development of vehicles which require no human intervention will reduce the use of public mobility platforms and offer individual mobility to new user groups.
Shared – Professionally managed fleets of shared vehicles will reduce the cost of mobilty by a significant amount through more efficient use of expensive mobile assets.
Connected – This applies in two ways: communication between cars or with traffic management infrastructure or between vehicle occupants and the outside world. The car of the future will become a “third place” between home and workplace, combining features of both.
‘Yearly’ updated – The range of models will be updated annually to integrate the latest hardware and software developments, and react to changing requirements of shared fleet buyers.
- Lidar, Radar, Sensors, ADAS
- ADC/DAC up to 20GB/s sampling (customizable)
- ASIL-B, ASIL-D support
- RISC-V 32 bit / 64 bit processors + DSP extensions
- SerDes multiprotocol support
- 25GE, Automotive Ethernet
- MIPI C-PHY, D-PHY, A-PHY
- PLL N3, N4, N5, N6/7, 12FFC, 16FFC
- RFIC and Mixed Signal ASICs
- Advanced Package / Substrate Design - automotive qualified
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