Quantum Leap Solutions offers an extensive portfolio of silicon proven digital and analog IP across many process platforms. IP is available Off the Shelf or can be ported or customized to your application requirements.
QuickLogic, a trusted partner of Quantum Leap Solutions, brings over 35 years of expertise in FPGA technology. Headquartered in San Jose, CA, and ISO-9001 certified, QuickLogic is a NASDAQ-listed company (QUIK) known for its innovative programmable logic solutions.
Key Offerings:
Market Applications:
QuickLogic's solutions are widely adopted in various markets, including aerospace and defense, industrial automation, automotive, data centers, and wireless communication. Their eFPGA technology is particularly beneficial for applications requiring efficient calculation, precise timing, security, and size, weight, power, and cost reduction (SWAP-C).
Recognition:
QuickLogic has been honored with multiple awards, including BAE Systems' 'Partner 2 Win' Supplier of the Year award and the 'FAST LabsTM Technology Innovation Partner Of The Year' award, highlighting their dedication to delivering state-of-the-art embedded FPGA Hard IP capability to the Defense Industrial Base.
Innovative Solutions:
QuickLogic's FPGA-based solutions offer flexibility, adaptability, and built-in security features. Their technology enables continuous reprogramming to comply with updated security standards, making them a pivotal tool in the defense against cyberattacks.
Future Vision:
QuickLogic is committed to advancing programmable logic solutions with their chiplet vision, supporting new process nodes and enabling seamless integration with other chiplets based on application needs.
High performance data converter IP silicon proven on TSMC, GlobalFoundries and Trusted Foundries. 5GS/s, 10GS/s and 20GS/s ADC and DAC architectures. Customizable to your end applications. Suitable for sensing, automotive LiDar and Radar, satellite communications, defense and aerospace applications. Radiation hardened options available as well.
Our focus areas are:
IP / macro solutions for your wireless designs
Automotive IP from our partners
Areas of expertise:Chiplet technology is a different way of integrating multiple dies in a package or system. There are several approaches to chiplets. The basic idea is that you have a menu of modular chips, or chiplets, in a library. Then, you assemble chiplets in a package and connect them using a die-to-die interconnect scheme. In theory, the chiplet approach is a fast and less expensive way to assemble various types of third-party chips, such as I/Os, memory and processor cores, in a package.
With an SoC, a chip might incorporate a CPU, plus an additional 100 IP blocks on the same chip. That design is then scaled by moving to the next node, which is an expensive process. With a chiplet model, those 100 IP blocks are hardened into smaller dies or chiplets. In theory, you would have a large catalog of chiplets from various IC vendors. Then, you can mix-and-match them to build a system. Chiplets could be made at different process nodes and re-used in different designs.